TIMAR D5SNS SODIMM 内存条
Adhering to JEDEC standard design specifications, utilizing premium DRAM resources, and undergoing 100% rigorous testing, it delivers outstanding performance and compatibility. Through Bank Group technology, an 8-bit prefetch mechanism is achieved, while dynamic modes provide optimal power-saving efficiency. It supports all standard DDR interfaces, requires no hardware debugging, and is ready for immediate application upon adaptation.
Features
1. High-Quality Components: Utilizes premium memory chips, with all components sourced from globally leading DRAM chip suppliers.
2. Resistance to Harsh Industrial Environments: Provides technologies such as wide temperature range, 30µ" gold fingers, anti-sulfurization, and ECC error correction to meet the demands of various industrial application environments.
3. Tailored Customization: Offers multiple DIMM types and varying board heights, suitable for various embedded systems and space-constrained equipment.
Product Specification
| PN | TMD5SHAAD1656S-00N0 | TMD5SHACD3256S-00N0 |
| Module Name | TIMAR D5SNS 16GB DDR5 | TIMAR D5SNS 32GB DDR5 |
| Interface | DDR5 SODIMM | DDR5 SODIMM |
| Flash Type | 3D TLC | 3D TLC |
| Capacity | 16G | 32G |
| Rank | 1R×8 | 2R×8 |
| Speed (MT/s) | 5600 | 5600 |
| CAS Latency (tCK) | 46 | 46 |
| Timing | 46-45-45 | 46-45-45 |
| Clock (MHz) | 2800 | 2800 |
| VDD/VDDQ(V) | 1.1V (-33mV / + 66mV) | 1.1V (-33mV / + 66mV) |
| VPP(V) | 1.8V (-54mV / + 108mV) | 1.8V (-54mV / + 108mV) |
| Operation Temperature | 0~85℃ | 0~85℃ |
| Gold finger plating thickness | 30″ | 30″ |
| Dimension (WxLxH/mm) | 69.6 x （30 mm ± 0.15 mm）*（1.2 ± 0.1 mm） | 69.6 x （30 mm ± 0.15 mm）*（1.2 ± 0.1 mm） |
| PIN Count | 262 | 262 |
| Thermal Sensor | yes | yes |
| Storage Temperature | -55~100℃ | -55~100℃ |
